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Items
Technology Data
Layer count
Double layer
Max manufacturing size
1200mm*250mm
Board thickness
0.07mm—1.0mm
Min line width/space
2mil / 2mil
Outline tolerance
Punching
+/-0.05mm
laser
+/-0.03mm
Stiffener type
PI
0.1 to 0.4mm
Impedance control tolerance
+/-10%
Surface treatment
Immersion Gold(ENIG); Immersion Tin; Immersion Ag; ENEPIG,Flash Gold; Hard Gold; OSP...
Polymide thickness
0.3mil, 0.5mil, 1mil, 2mil, 3mil, 4mil
Application
FPC aerospace, military, mobile communications, portable computers, computer peripherals, PDA, digital cameras and other areas or products have been widely used
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